Nihon Superior, a provider of advanced soldering materials to the international market, has announced that it will launch the SN100C P810 D4 lead-free low-voiding solder paste at the IPCA International Expo, which will be conducted at the KTPO Trade Centre in Bangalore, India, from July 25 to 27, 2012.
Nihon Superior SN100C P810 D4 Void Area Comp
Incidence of voiding will be lowered when power semiconductors and their substrates are reflowed using this new SN100C P810 D4 solder joints, when compared to traditional lead-free solder paste. The company has formulated this lead-free solder paste in such a way that it provides exceptional reflow with reduced mid-chip balling and features excellent wetting on all ordinary substrates. This new paste offers low voiding and is highly reliable. The test results of this paste have shown that when utilized along with vacuum reflow, this lead-free solder paste can create solder joints on 19x19 mm joints and pads to energize transistors with voiding of less than 1%.
The company’s SN100C, a compliant alloy devoid of lead and silver, forms the basis of this new SN100C P810 D4 solder paste. SN100C has high impact strength and offers cost benefits when compared to silver-based alloys. Reflowing of SN100C can be done with profiles identical to those normally used with alloys like SAC405 and SAC305.
The flux content of this new solder paste is 11.5%. The spread factor and the melting point of the paste are 227°C and 75%, respectively.