Applied Films Presents Sputtering Solution for Flexible Copper Clad Laminates

Applied Films presents its manufacturing solution for Flexible Copper Clad Laminates at the InterNepcon show 2006, January 18 - 20, 2006, in Tokyo. The company showcases a cost effective sputter deposition machine for the seed-layer of electroplated adhesive-less flexible copper clad laminates. Located in East Hall 4, booth number 32-35 the experts of Applied Films will illustrate the sputter metallizing process and its advantages such as the peeling strength of sputtered layers of more than 0.8 N/mm.

Producing the fine structures of High Density Interconnects (HDI)-FPC with less than 20 µm conductor width in high volume demands for highly precise manufacturing processes. With the new Applied Films SMARTWEB™ system, PET and Polyimide films of 12 µm can be coated with a standard copper seed layer of less than 200 nm thickness in continuous production. Unlike other conventional sputtering systems, the SMARTWEB™ allows double-side metallization in a two-pass production. With its small footprint of less than 2.5 meters in height and its clean room compatible design, the SMARTWEB™ system can easily be integrated into any production environment. Applied Films’ sputtering technology offers manufacturers a better alternative to the commonly used cast and laminating processes for extra thin flexible copper clad laminates (FCCL).