Indium Corporation Features Indium8.9HF Solder Paste Series at SMTconnect 2019

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste series to help customers Avoid the Void^® at SMTconnect, May 7-9, in Nuremberg, Germany.

The Indium8.9HF series is a proven product that delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding—plus enhanced electrical reliability and improved stability—during the printing process. Under optimal process conditions, this series:

• Exceeds all requirements for enhanced electrical reliability and SIR performance
• Demonstrates consistent printing performance for up to 12 months when refrigerated
• Maintains excellent printing and reflow performance after remaining at room temperature for one month
• Delivers excellent response-to-pause, even after being left on the stencil for 60 hours
• Resists premature flux spread to prevent surfaces from oxidizing
• Performs with both Pb and Pb-free alloys

The Indium8.9HF Solder Paste series provides a unique oxidation barrier technology that eliminates HIP defects and graping, making them perfectly suited for automotive assembly and a variety of electronics assembly applications. In fact, the product meets HKMC MS184-01 testing criteria Type B, one of the toughest automotive criteria to ensure reliability.