May 17 2019
The SMTconnect once again brought together people and technologies from the areas of development, production, services and applications in connection with microelectronic assemblies and systems and offered the participants a diverse program in Nuremberg, Germany, from 7 - 9 May 2019.
Credit: SMTconnect
Numerous Popular Visitor Highlights
The exhibition, which was held for the first time under the new name, offered many popular program highlights this year. Among them was the EMS Park, which gave companies from the contract manufacturing sector their own platform. It was designed with a focus on networking opportunities and with a small Speakers' Corner in which exhibitors could present their topics and solutions. The EMS Park created an ideal platform for a concentrated exchange on Electronics Manufacturing Services.
The more than 13,000 visitors were able to enjoy other special showcase areas in addition to the EMS Park. At the showcase area "PCB meets Components" exhibitors presented their solutions around the topics printed circuit boards, components and materials. In addition, the Newcomer Pavilion gave them an overview of various newcomers to the industry and to the event and enabled them to make valuable contacts.
Another highlight was the "Future Packaging" production line organized by the Fraunhofer IZM, which was held in 2019 under the motto "Get In The Ring - Meeting the challenges of modern manufacturing". Visitors were able to experience all production steps "live" and discuss issues and challenges with experts.
The annual hand soldering competition by the IPC - Association Connecting Electronics Industries from the USA, in which soldering experts and young professionals demonstrated their skills, also attracted numerous spectators.
National and International Exhibitors Showcased Their Solutions
More than 400 exhibitors presented all technical processes in the production of electronic assemblies with their products and solutions.
“The exhibition is always a significant industry event. One finds out so much about innovations in the production of electronics, substrates and systems to do with mounting and connection technologies. In addition, one can get an overview of numerous solutions on current topics such as digitalization, automation and robotics,” summarizes Dr. Christoph Weiß, Deputy Managing Director PCB and Electronic Systems Division at the
ZVEI – German Electrical und Electronic Manufacturers’ Association and exhibitor at the SMTconnect 2019.
Technology Days Focused on Soldering and Substrates
At the Technology Days, which took place for the first time and were devoted to the mounting and connecting of components and assemblies, the 164 participants were able to find out about new developments in materials and technology, possible problems and their solutions for soldering and substrates.
The next SMTconnect will take place in Nuremberg from 5 - 7 May 2020.