Nov 16 2006
Avago Technologies today introduced the industry’s thinnest surface mount (SMT) light emitting diodes (LEDs) in the smallest industry-standard (0603) footprint available. With an ultra small form factor about the size of a pencil tip, these low-power LEDs use high-brightness chips to provide excellent illumination with minimum current consumption. These new ChipLED lamps from Avago are available in blue and phosphor white -- the colors most widely used by handset manufacturers. Avago is a leading supplier of innovative semiconductor solutions for advanced communications, industrial and commercial applications.
Avago’s ultra-thin HSMR-CL25 (Blue) and HSMW-CL25 (White) LEDs are ideal for backlighting keypads and status indicators in the thinnest handsets, as well as for office automation devices and consumer electronics. Moreover, these new top emitting LED packages represent a lower-cost alternative to electroluminescent (EL) backlighting, eliminating the need for high voltages and difficulties with high-frequency electrical noise.
By introducing the world’s thinnest top emitting surface mount LEDs in an industry-standard ChipLED package configuration, designers can develop even smaller and thinner mobile handsets, handheld games and other miniature devices.
Features
- The Avago HSMR-CL25 is indium gallium nitride (InGaN) blue, with 473 nm dominant wavelength and 11.2-45-mcd luminous intensity; the HSMW-CL25 is InGaN phosphor white with 28.5-112.5-mcd luminous intensity. All intensities are typical, measured at 5 mA drive current, and all packages use diffused optics. The top emitting package, with its wide viewing angle, is suitable for direct backlighting or use with light pipes
- Package is compatible with infrared (IR) reflow soldering and Avago’s precision manufacturing techniques ensure perfect pick-up by automated manufacturing equipment
- Special leadframe construction of the HSMx-CL25 lead-free Avago ChipLED package series provides efficient transfer of heat away from the LED chip, to permit operation over the –40° C to +85° C temperature range
- Package dimensions: 1.6 mm (L) by 0.8 mm (W) by 0.25 mm (H)