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Multilayered Cobalt Thin Films Deposited by The Underpotential Deposition Process (UDP)

Cobalt based materials have found strong application in areas including sensors, catalysts, energy storage and magneto-optic recording media. When used in these fields the cobalt is used in the form of multilayered thin films. Thin films are produced using a range of techniques but the emerging process of electrodeposition is gaining popularity.

Of the electrodeposition techniques, the underpotential deposition process (UPD) appears to be a serious contender as it can be carried out at room temperature and pressure. In order to gain a deeper insight into this system, Mexican researchers L.H. Mendoza-Huizar, C.H. Rios Reyes, M. Rivera and C.A. Galán-Vidal from the Universidad Autónoma del Estado de Hidalgo, Universidad Autónoma Metropolitana-Azcapotzalco and Ciudad Universitaria, carried out a voltammetric study about the UPD process of cobalt onto glassy carbon electrodes from ammoniacal solutions.

The analysis of the experimental data clearly showed the presence of a diffusional-controlled underpotential deposition of cobalt onto glassy carbon electrode (GCE). The voltammetric studies suggested the existence of at least two phases of cobalt deposited in UPD conditions. These results pave the way for further research and place the underpotential deposition process a step closer to being a commercially viable technique for producing multilayer cobalt thin films.

The article is available to view at https://www.azom.com/Details.asp?ArticleID=3628

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