The SPS-M is a spot plasma source developed for cleaning and activating substrates to enhance adhesion. It is perfect for electronics manufacturing and semiconductor packaging.
The Surfx AtomfloTM 600 controller powers the SPS-M plasma source by delivering radio frequency (RF) power, argon gas flow at 10 LPM, and 1.0 % hydrogen, oxygen, or nitrogen. The head's temperature is regulated through liquid cooling to maintain consistency. When activated, the system generates a uniform, electronically neutral, and particle-free plasma beam that fills the 2 mm aperture, bathing the substrate in a flow of active hydrogen, oxygen, or nitrogen.
SPS-M Specifications
Plasma Beam Size
Dimensions (W × D × H)
- 2.99 × 2.24 × 5.91 inches
- 76 × 57 × 150 mm
Weight
0.45 kg (1.0 lbs)
Patented Plasma Technology
- RF capacitive discharge
- Atmospheric argon plasma
- O2, H2, N2 plasma chemistry
SPS-M
The SPS series plasma sources are specifically developed for precise, low-temperature surface treatment of materials, ensuring no particle addition or damage.
Source: Surfx Technologies, LLC
| Specifications |
| Plasma aperture diameter |
2 mm |
| Plasma effective diameter at substrate |
10 mm |
| External dimensions (W*D*H) |
76 x 57 x 150 mm (2.99 x 2.24 x 5.91 inches) |
| Weight |
0.45 kg (1.0 lbs) |
| Maximum RF power |
270 W at 27.12 MHz |
| Plasma gas |
Argon (Ar) |
| Process gases |
Oxygen (O2), nitrogen (N2), or hydrogen (5.0 % H2 in Ar) |
Image Credit: Surfx Technologies, LLC