The SPS-100 from Surfx Technologies is a linear beam plasma source developed for cleaning and activating substrates to enhance adhesion. It is suitable for electronics manufacturing and semiconductor packaging.
The Surfx AtomfloTM 600 controller powers the SPS-100 linear plasma source by supplying radio frequency (RF) power, argon gas flow at 32 LPM, and 1.0 % hydrogen, oxygen, or hydrogen. Liquid temperature control is maintained through the head to ensure consistency. When activated, the system produces an electrically neutral, particle-free, uniform plasma beam that fills the 100-mm-wide slit, bathing the substrate in a flow of active hydrogen, nitrogen, or oxygen atoms.
Image Credit: Surfx Technologies, LLC
SPS-100 Specifications
Plasma Beam Size
Dimensions (W × D × H)
- 6.67 × 1.26 × 3.397 inches
- 169 × 32 × 101 mm
Weight
Patented Plasma Technology
- Atmospheric argon plasma
- RF capacitive discharge
- O2, H2, N2 plasma chemistry
SPS-100
The SPS series plasma sources are engineered for precise surface treatment of materials at low temperatures, ensuring zero damage and no particle addition.
Source: Surfx Technologies, LLC
| Specifications |
| Plasma beam |
width 100 mm (4.0 inches) |
| External dimensions (W*D*H) |
169 x 32 x 101 mm (6.66 x 1.26 x 3.97 inches) |
| Weight |
0.8 kg (1.75 lbs) |
| Maximum RF power |
600 W at 27.12 MHz |
| Plasma gas |
Argon (Ar) |
| Process gases |
Oxygen (O2), nitrogen (N2), or hydrogen (5.0% H2 in Ar) |
Image Credit: Surfx Technologies, LLC