Reliance Steel & Aluminum Co. announced today that it has sold the assets and business of the Encore Coils division of Encore Group Limited, a subsidiary of Reliance, to Samuel Son & Co., Ltd., headquartered in M...
Cabot have acquired the assets of AP Materials. This includes the technology that they will use to produce the next generation of tantalum powders.
Having made its first direct appointment in the United States in 2007, powder characterization company Freeman Technology has seen continued growth in sales of the FT4 Powder Rheometer into this market, with the pharmaceutical sector particularly strong.
Carpenter Technology Corporation and Titanium Metals Corporation today announced joint agreements under which Carpenter will provide specialized titanium conversion processing to TIMET and TIMET will supply Carpenter wit...
Pipe joints require a high level of guaranteed performance and as a consequence the industry uses advanced technology in both fitting manufacture and joint sealing. AMI has reviewed the state of the European pipe industry - around 3.5 million tonnes of plastics are used per annum.
Tiny copper structures with pores at both the nanometer and micron size scales could play a key role in the next generation of detonators used to improve the reliability, reduce the size and lower the cost of certain mil...
The Middle East is experiencing rapid growth and there are excellent opportunities for suppliers to the construction industry in the region. There are major applications of pipe in the development of new housing, busines...
Marks and Spencer has introduced new "environmentally friendly" packaging for its range of Swiss chocolates with the innovative Plantic Technologies Limited.
In store now, the new chocolate box contains an a...
Microelectromechanical systems (MEMS) are tiny components etched from silicon. Production is extremely complex, sometimes with hundreds of steps, each with dozens of parameters. One European project has developed softwar...
Complex three-dimensional (3D) integrated circuits involving both optical and electronic elements are now easier to make, thanks to a “wafer bonding” technique developed by a European research consortium. Wit...
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