Indium Corporation’s Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23.
Dow Corning, a global leader in silicon and wide-bandgap semiconductor technology, today established a higher industry standard for silicon carbide (SiC) crystal quality by introducing a product grading structure that specifies ground-breaking new tolerances on killer device defects, such as micropipe dislocations (MPD), threading screw dislocations (TSD) and basal plane dislocations (BPD).
For the sixth time, Dow Electronic Materials, a business unit of The Dow Chemical Company, has received the New Product Introduction (NPI) Award from Printed Circuit Design and Fab (PCD&F) Magazine with its MICROFILL™ LVF-3 Acid Copper.
According to a new market research report "Connected Living Room Market by Products (Smart/3D, LED/LCD/OLED TV, set top box, Home theater (Projector, Audio Equipment), Blu-ray player, Gaming console), Technology (Processor, Memory, Sensor, Connectivity) & Geography - Global Trend & Forecast to 2013 - 2020", published by MarketsandMarkets, the total Connected Living Room Market is expected to cross $957.65 Billion by 2020, at a CAGR of 6.8% rate from 2014 to 2020.
Efficient Power Conversion Corporation, the world’s leader in enhancement-mode gallium nitride on silicon (eGaN®) power FETs will be presenting three application-focused technical presentations at PCIM Europe. The conference will be held in Nuremberg, Germany from May 20th through the 22nd.
BASF today inaugurated a new Electronic Materials Sampling and Development facility in Hillsboro, Oregon. The new facility is a strategic step towards establishing a North American footprint to supply materials for semiconductor manufacturing applications related to the electronics industry.
Rubicon Technology, Inc., a leading provider of sapphire substrates and products to the LED, semiconductor, and optical industries, today announced that the company will showcase its line of high quality optical products for use in defense and aerospace, instrumentation and analytical processing, sensors and detectors, semiconductor process equipment, and medical and laser applications at the SPIE Defense, Security and Sensing 2014 exhibition from May 6 to 9 at the Baltimore Convention Center in booth #1032.
An enormous treasure slumbers in the depths of our planet. Temperatures of up to 7000 °Celsius are thought to be present in the Earth's core, while at a depth of four to six kilometers (2.5 to 3.5 miles) it is still 150 °C to over 200 °C. These gigantic reserves of heat can be used as a renewable source of energy for geothermal power.
The ever-increasing demands for miniaturization and higher functionality at less cost processes have driven the development of stacked ICs and System in Package (SiP) technologies. System in Package (SiP) is a single reduced functional module realized by the horizontal tiling or vertical stacking of two or more similar or dissimilar bare die or packaged chips.
Manganites – compounds of manganese oxides – show great promise as “go-to” materials for future electronic devices because of their ability to instantly switch from an electrical insulator to a conductor under a wide variety of external stimuli, including magnetic fields, photo-excitations and vibrational excitations.
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