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Silicone Elastomer from Multibase Improves C5 Tablet PC Durability

Chinese Chip Manufacturer Orders NEXX’s Tool for Wafer-Level Packaging

Automotive, Aerospace Customers Select Integral’s ElectriPlast Pellet

Mitsubishi Electric to Invest in Wafer Manufacturing Capacity Expansion

Mitsubishi Electric to Invest in Wafer Manufacturing Capacity Expansion

IMEC Makes Major Step Towards 20nm Interconnects

NEXX‘s Stratus Tool Preferred in Lead-Free Bumping Market

New Ultra-Thin Wafer Dicing Solution Released by ESI

New Ultra-Thin Wafer Dicing Solution Released by ESI

Applied Materials to Service Production Equipment at NXP’s Facility

Applied Materials to Service Production Equipment at NXP’s Facility

Applied Materials Releases New AdvantEdge Mesa Etch System

Applied Materials Releases New AdvantEdge Mesa Etch System

ON Semiconductor Unveils New Silicon-Based PureEdge Devices

ON Semiconductor Unveils New Silicon-Based PureEdge Devices

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