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Master Bond's Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K).

From Master Bond Inc. 4 Aug 2021

New Study Could Help Commercialize Next-Generation Flexible, Printable Electronics

At the Technische Universität Dresden (TU Dresden), physicists have established the first implementation of a complementary vertical organic transistor technology, which can operate at low voltage, with adjustable inverter properties, and a fall and rise time of below 10 ns shown in inverter and ring-oscillator circuits, respectively.

19 Jul 2021

Researchers Take First Snapshots of Atoms Moving Inside Tiny Switches

Electronic circuits that compute and store information contain millions of tiny switches that control the flow of electric current.

16 Jul 2021

3D Printing of Electronics Could Revolutionize the World

In the age of digitalisation, electronics products are becoming increasingly ubiquitous.

13 Jul 2021

Panacol Introduces New Reworkable Underfill Adhesive

Panacol has developed a new reworkable underfill for consumer electronics. The reworkability and fluorescence despite its black color of the new Structalit® 5751 adhesive allows manufacturers to reduce both manufacturing costs and environmental impact by reusing electronic components mounted on PCBs.

From Panacol-Elosol GmbH 13 Jul 2021

Novel Bipedal DNA Walking Nanomachine Based on DNA Logic Circuits

The complementary base pairing rules can be used to design and assemble a wide range of complex secondary structures, which can help develop DNA molecular devices with unique functions that significantly contribute to diverse research fields.

12 Jul 2021

Improved Sputtering Technique Helps Reduce Stress in Tungsten Thin Films

At the Tokyo Metropolitan University, scientists have employed high-power impulse magnetron scattering (HiPIMS) to make thin films of tungsten with unparalleled low levels of film stress.

5 Jul 2021

Nordson Electronics Solutions Introduces the MARCH MegaVIA™ Plasma Treatment

Nordson Electronics Solutions, a division of Nordson Corporation, a global leader in plasma processing technology, introduces the MARCH MegaVIA™ Plasma Treatment System with a 15-cell configuration for panel sizes up to 30 x 52 inches in printed circuit board manufacturing.

From Nordson MARCH 30 Jun 2021

New Semiconductor Material Reduces Heat and Boosts Performance of Computer Processors

Engineers from the University of California, Los Angeles (UCLA), have successfully incorporated a new semiconductor material into a high-power computer chip to reduce the build-up of heat on processors and thus enhance their performance.

30 Jun 2021

Researchers Develop Ultra-Fast Switching Memory Devices Using Halide Perovskites

A research team led by Professor Jang-Sik Lee of Pohang University of Science and Technology has successfully developed the halide perovskite-based memory with ultra-fast switching speed.

23 Jun 2021

Editorial Highlights

The Current State of the Global Semiconductor Market

The global semiconductor market has entered an exciting period. Demand for chip technology is both driving the industry as well as hindering it, with current chip shortages predicted to last for some time. Current trends will likely shape the future of the industry, which is set to continue to show

How are Graphene Batteries Made?

The primary distinction between graphene-based batteries and solid-state batteries lies in the composition of either electrode. Although the cathode is commonly changed, carbon allotropes can also be employed in fabricating anodes.

What Role Will The IoT Play In The Electric Vehicle Industry?

In recent years, the IoT is rapidly being introduced into almost all sectors, but it has particular importance in the EV industry.

Electronics News

Master Bond's Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy

New Study Could Help Commercialize Next-Generation Flexible, Printable Electronics

Researchers Take First Snapshots of Atoms Moving Inside Tiny Switches

3D Printing of Electronics Could Revolutionize the World

Panacol Introduces New Reworkable Underfill Adhesive

Novel Bipedal DNA Walking Nanomachine Based on DNA Logic Circuits

Improved Sputtering Technique Helps Reduce Stress in Tungsten Thin Films

Nordson Electronics Solutions Introduces the MARCH MegaVIA™ Plasma Treatment

New Semiconductor Material Reduces Heat and Boosts Performance of Computer Processors

Researchers Develop Ultra-Fast Switching Memory Devices Using Halide Perovskites

How are Fine Ceramics Supporting the Next Generation of Renewable Energy?

Beyond Lithium: How Group14 Is Redefining the Future of Battery Technology

Decoding Catalytic Processes: Advancing FTIR Research with Iso-Potential Operando Spectroscopy

SU7000 & SU8700 Schottky Field Emission SEMs: Ultra High-Resolution & Analytical Imaging

TSL-570: High Performance Tunable Laser

Advanced Reconstruction Toolbox from ZEISS

Sponsored Content

Sheet Resistance Measurement on TOPCon Solar Cells

The Link Between FIB-SEM and TEM

Comprehensive Guide: Checkweighing

Characterizing Hyaluronic Acid with Online Multi-Angle Light Scattering

Editorial Highlights

The Current State of the Global Semiconductor Market

How are Graphene Batteries Made?

What Role Will The IoT Play In The Electric Vehicle Industry?

Electronics News

How are Fine Ceramics Supporting the Next Generation of Renewable Energy?

Beyond Lithium: How Group14 Is Redefining the Future of Battery Technology

Decoding Catalytic Processes: Advancing FTIR Research with Iso-Potential Operando Spectroscopy

1Aluminum-Scandium Alloys: A Game Changer for Hydrogen Energy

2Recycled Milled Carbon Fibers for Automotive Parts Manufacturing

3Developing Digital Twins for Durable 3D-Printed Military Parts

4Neutrinos are at Least a Million Times Lighter Than Electrons

5NanoMOFs: Enhancing Anti-Counterfeiting Through Multi-Spectral Photonic Security

6Improving Wound Care with Bioactive Material-Based Dressings

Sponsored Content

Editorial Highlights