Packaging News

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Upgrade of SFI Fiber Sourcing Certification by KapStone

New Additives from Milliken Extend the Range of Possibilities for Polyolefins

Chinese Chip Manufacturer Orders NEXX’s Tool for Wafer-Level Packaging

FirstCarbon Helps APT to Decrease Greenhouse Gas Emissions Across Supply Chain

FirstCarbon Helps APT to Decrease Greenhouse Gas Emissions Across Supply Chain

Lanzhou’s Unique Formulation Enhances Normal Polyvinal Alcohol Film

Windset Receives Exclusive License to Use Landec’s Breathable Packaging

Windset Receives Exclusive License to Use Landec’s Breathable Packaging

Polyester and PET Markets to be Discussed at Global Conference

Multi Packaging Solutions Shifts to Green Energy

Multi Packaging Solutions Shifts to Green Energy

NEXX‘s Stratus Tool Preferred in Lead-Free Bumping Market

New Ultra-Thin Wafer Dicing Solution Released by ESI

New Ultra-Thin Wafer Dicing Solution Released by ESI

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