Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced availability of its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry for use in lead-free solder bump plating applications. This next-generation formulation features enhanced plating performance, bath stability and ease-of-use, thereby enabling the industry's widest process window with the most robust process flexibility and a competitive cost of ownership (COO).
ZMD AG (ZMDI), a Dresden-based semiconductor company that specializes in enabling energy-efficient solutions, today announces that it is the proud recipient of the regional "Best Company for Innovation and Sustainability Award" from the International Alternative Investment Review (IAIR) magazine.
Today, ASML and imec announced the next major step in their extensive collaboration, with the launch of the Advanced Patterning Center. Together they plan to tackle upcoming scaling challenges due to the chip industry’s move towards single digit nanometer dimensions. The Center will be located at the imec campus in Leuven and is expected to grow to close to 100 engineers over the next couple of years.
Linde North America praised President Obama for signing legislation into law reauthorizing the Federal government's helium program, which is the source of 40% of the nation's helium. The legislation was passed last week by a bipartisan vote of the U.S Senate and House of Representatives.
ZMD AG (ZMDI), a Dresden-based semiconductor company that specializes in enabling energy-efficient solutions, today announces the product release of an energy-efficient DC/DC regulator for non-isolated step-down applications.
Oerlikon Advanced Technologies, a leading supplier of PVD deposition equipment, has today set a new standard with the CLUSTERLINE® 300 as the first 300mm system worldwide running thin wafer backside metallization (BSM) for power devices in production.
Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it has received an order for the Company's innovative, new Purion MTM medium current implanter.
Cascade Microtech, Inc., a leader at enabling precision measurements of integrated circuits at the wafer level, has acquired ATT Advanced Temperature Test Systems GmbH ("ATT Systems"), which is headquartered in Munich Germany. ATT Systems is a leader in the manufacturing of advanced thermal systems used in the testing of semiconductor wafers.
Fairchild Semiconductor, a leading global supplier of high performance power and mobile semiconductor solutions, and Micross Components, a leading global provider of specialty electronic solutions, have entered into an agreement establishing Micross as an authorized supplier of Fairchild’s bare die products.
FUJIFILM Corporation (President: Shigehiro Nakajima) and imec (CEO: Luc Van den hove) have developed a new photoresist1 technology for organic semiconductors2 that enables the realization of submicron3 patterns.
Terms
While we only use edited and approved content for Azthena
answers, it may on occasions provide incorrect responses.
Please confirm any data provided with the related suppliers or
authors. We do not provide medical advice, if you search for
medical information you must always consult a medical
professional before acting on any information provided.
Your questions, but not your email details will be shared with
OpenAI and retained for 30 days in accordance with their
privacy principles.
Please do not ask questions that use sensitive or confidential
information.
Read the full Terms & Conditions.