Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced that it has received ON Semiconductor’s Perfect Quality Gold Award for 2012. Dow earned the award based on its perfect quality score for both 2011 and 2012 in ON Semiconductor’s FE Supplier Performance Rating as a supplier of chemical mechanical planarization (CMP) and lithography materials.
Dow Electronic Materials, a business unit of The Dow Chemical Company, announces that it has received ON Semiconductor's Perfect Quality Gold Award for 2012.
Dow earned the award based on its perfect quality score...
Research and Markets has announced the addition of the "Semiconductor Equipment Manufacturers (Global)" report to their offering.
Vishay Intertechnology, Inc. today announced that Vishay Intertechnology Asia Pte Ltd has received the 2012 Diamond Award and the 2012 Supplier Excellence Award, Silver, from TTI Electronics Asia Pte Ltd. Vishay is one of the world’s largest manufacturers of discrete semiconductors and passive electronic components. TTI is the world’s leading authorized distributor specialist offering passive, connector, electromechanical, and discrete components.
The semiconductor industry’s march toward broader 3D IC integration marked animportant milestone this week at the 2013Electronic Components & Technology Conference (ECTC), with the report of an advanced new temporary bonding solution for 3D Through-Silicone-Via (TSV) semiconductor packaging. The breakthrough was unveiled during ECTC’s 3D Materials and Processingsession, when Ranjith John, materials development & integration engineer at Dow Corning, presented a paper co-authored by Dow Corning, a global leader in silicones, silicon-based technology and innovation, and SÜSS MicroTec, a leading supplier of semiconductor processing equipment.
Singapore’s A*STAR Institute of Microelectronics (IME), Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Incorporated, and STATS ChipPAC have announced a collaboration to develop technology building blocks for Low Cost Interposers (LCI) for 2.5D ICs.
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone today at ECTC 2013, with the report of an advanced new temporary bonding solution for 3D Through-Silicone-Via (TSV) semiconductor packaging.
Avnet Memec, an Avnet, Inc. company, a leading global technology distributor, has been selected as a pan-European distributor for Macronix International Co., Ltd., a leading provider of non-volatile memory semiconductor solutions.
Leading semiconductor test equipment supplier Advantest Corporation announced today that it has earned a place on the VLSIresearch list of the 10 BEST Suppliers for 2013. For the 25th consecutive year, ratings from the world's leading producers of semiconductors - IDMs, OSATs and Fabless companies - have secured Advantest a position on the time-honored survey conducted by leading industry-analyst firm, VLSIresearch inc (Santa Clara, California.).
EMCORE Corporation, a leading provider of compound semiconductor-based components and subsystems for the fiber optic and solar power markets, announced today that it has been awarded a contract by ATK (NYSE:ATK) to design and manufacture solar panels for NASA's Green Propellant Infusion Mission (GPIM) planned for launch in 2015.
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