The Balver Zinn/Cobar Group has proclaimed that its US division, Cobar Solder Products will unveil Alpine OT2, a solder paste devoid of halide and halogen, at the SMTA International Conference & Exhibition to be conducted from 18 and 19 October 2011 at the Fort Worth Convention Center located in Fort Worth, Texas.
Alpine OT2
The solder paste’s newly developed flux medium has novel properties that remove flaws caused by miniaturization and oxidation. Less amount of solder paste is required for smaller components and pitch sizes but the paste has sufficient activation to fulfill the demands of contemporary processes.
Alpine OT2 is offered with inexpensive alloys, including SCANGe-071 and SN100C. These solder pastes have low or no silver content and are suitable for cost-driven markets. However, Alpine OT2 is also offered in SAC305. The flux medium based on rosin facilitates printing even at high printing speeds of more than 200 mm/sec.
The solder paste’s superior activation system makes it to remove the head-in-pillow flaws that are important in zero-lead soldering of BGAs. Flaw or graping is not showed by this paste even with ultra-small components, including 01005 and 0201s. It offers ideal wetting conditions for the highly dependable solder joints.
The Balver Zinn/Cobar has a team of experts, who have vast experience in all kinds of selective solder applications. The company utilizes its advanced labs located in Breda (NL) and Balve (D) for investing in chemistry and/or metallurgy.