BTU International, a provider of sophisticated thermal processing systems for the electronics and renewable energy markets, has proclaimed that its dual-lane metallization firing system called TRITAN HV90 has surpassed industry norms for wafer breakage.
TRITAN HV90 dual-lane metallization firing system
The dual-lane metallization firing system delivers an output higher than 99.99%, surpassing also the industry norms for metallization firing. The three-speed, three-belt equipment has higher output at 3600 wafers per hour. It also features an edge belt, a single zone spike having a spike time of below 3 s and low-volatile organic compound.
With the novel TriSpeed technology of BTU International, the TRITAN HV90 system enables its users to take the full benefits of higher ramp rates of the order of up to 200º C/s without compromising on the cooling and drying sections of the profile. The system offers unprecedented control over the development of profiles. It has constantly improved the fill factor in trails, ensuing enhanced efficiency.
The Product Marketing Manager for BTU International’s metallization products, Bob Bouchard commented that by optimizing the thermal profile, the TRITAN HV90 dual-lane metallization firing system helps customers to enhance cell efficiency and fill factor.
Bouchard further stated that according to a comprehensive field test data for more than a year of full production, the TRITAN HV90 had demonstrated a breakage rate below 0.01%, a value below one-half of the industry norm of 0.02%.