Research and Markets has declared that it now offers a new market research report titled, ‘Advanced IC Packaging Technologies, Materials, and Markets, 2011 Edition.’
Advanced IC packaging methods are vital, as the size of the final product is based on that of the printed circuit boards (PCBs), which in turn depends on the size of the IC packages. A chip’s packaging method also decides its performance, speed and battery consumption.
Devices include interconnection methods of flip chip and 2.5-D and 3-D through-silicon vias (TSVs), fan-out WLPs, fan-in QFNs, stacked packages and system in package (SiP) are driving the demand for sophisticated IC packaging technologies.
According to the report, the market of stacked packages, which have become an integral part of all kinds of mobile phones, is growing rapidly and its revenue will reach a CAGR of 10% through 2015. The report predicts that the TSV market will increase from 35 billion units in the fiscal year 2010 to more than 54 billion units in the fiscal year 2015. TSVs with three-dimensional interconnection forms a die stack having the shortest length of interconnection, with improved features of compact form factor, decreased parasitic, minimal power consumption and high speed.
The report expects that the sales of SiPs, which play a major role in decreasing the final product costs, will grow at a CAGR of 5.4% through 2015. Fan-In QFNs extend the count of rows of leads to two or three rows from the normal one row, which in turn increases the count of package leads to the order of hundreds from the typical value of less than 50. Revenues of Fan-In QFNs are expected to grow at 63.1% CAGR through 2015. As per the report, the sales of Fan-Out WLPs are anticipated to grow at a CAGR of 15.9% by 2015.