Sep 18 2013
Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the Business Electronic Soldering Technologies (BEST) 2013 Tech Symposium on Bottom Termination Components (BTC), September 25 in South Barrington, IL.
Sandy-Smith’s presentation, Minimizing Voiding in BTC Assembly, reviews proven approaches to minimize BTC voiding, including solder paste optimization, process modifications, and the addition of engineered solder preforms.
Sandy-Smith serves as a technical liaison between Indium Corporation’s customers and internal departments, such as research and development and production, to ensure that customers have the best quality and selection of products. She earned degrees in chemical engineering, with a focus on materials, and German language from the international engineering program at the University of Rhode Island.
Indium Corporation’s Brook Sandy-Smith, Product Support Specialist.
BEST is a supplier of PCB rework and repair services, serving communications, computer, industrial, automotive, avionic, and military markets. In addition, BEST is a master IPC-certified training center, certifying students and instructors in J-STD-001, IPC-610, and IPC 7711 and 7721 material. BEST has developed a variety of PCB rework and repair products.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation visit http://www.indium.com or email [email protected].