ZEISS Crossbeam 550 Samplefab, a powerful pre-configured high-end FIB-SEM, enables fully-automated and unattended preparation of TEM samples in the semiconductor lab.
Obtain optimal sample quality and automation reliability with high lamella success rates, particularly for multi-site preparations. Enjoy an easy-to-use interface that allows quick learning and maximum productivity without losing versatility.
- Maximize the potential for lab productivity
- Achieve dependable and precise endpointing
- Take advantage of unsupervised lamella processing from bulk sample to TEM grid with an automation yield promise of greater than 90%
Image Credit: Carl Zeiss Microscopy GmbH
Benefits
User-Friendly Interface for Easy Operation
The Crossbeam 550 Samplefab user interface has been fully revamped to enable rapid learning and intuitive use for novice and experienced users, delivering a consistent experience. The improved control software increases stability and usability, streamlining the operational procedure even more.
Image Credit: Carl Zeiss Microscopy GmbH
Automated TEM Sample Preparation for Optimized Results
The ZEISS Crossbeam 550 Samplefab microscope's hands-free TEM lamella preparation method can produce 10 lamellae in less than 8 hours, saving time and resources. Its innovative lift-out process delivers greater automated yield and the ability to thin down to 100 nm on a wide range of semiconductor sample types, delivering consistently high-quality output.
Superior Automation Yield for Maximum Success Rates
Recipe-based automation offers an automation yield of >90% when processing lamellae from bulk samples to TEM grids without operator assistance. To guarantee that no lamella is lost during processing, automated checks enable human interventions, bringing lamella success rates close to 100%.
Image Credit: Carl Zeiss Microscopy GmbH
Stable and Efficient Workflow for Increased Productivity
Using the Crossbeam Samplefab process, a single probe tip can be used to make dozens of lamellae. The procedure is so reliable that it only has to be reshaped after several days of intensive use. Ultimately, this saves time and money by greatly increasing the tool's productive uptime and lowering consumable costs.
Image Credit: Carl Zeiss Microscopy GmbH