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New Machine Can Bend 3D Profiles with Complex Cross Sections

New Machine Can Bend 3D Profiles with Complex Cross Sections

Rudolph Technologies Joins Leading Chipmakers in 3D Interconnect Program

Reconfigurable Computer Chip Seeks to be Efficient and Flexible

Reconfigurable Computer Chip Seeks to be Efficient and Flexible

Eco Friendly Noise Insulation Materials to be Incorporated into New Buicks

New Droplet Generation and Control Technologies Target Smart Materials Industries

New Droplet Generation and Control Technologies Target Smart Materials Industries

Brazillian Mining Giant Reduces Nickel Production in Light of Flagging Economy

Semiconductor Big Guns Collaborate on 28nm CMOS Technolgy

Thermoforming Equipment Manufacturer Releases 3rd Generation Pressure Forming Machines

Renowned Swiss Furniture Maker Chooses BASF Polyamide for Latest Creation

Renowned Swiss Furniture Maker Chooses BASF Polyamide for Latest Creation

Nanosurf Release New Version of World's Best Phase-Locked Loop (PLL) Detector

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