IBM engineers have developed a CMOS integrated nano-photonics technology that would help in producing 100Gb/s optical transceivers. This latest development will enable datacenters to provide higher data rates and bandwidth for Big Data and cloud computing applications.
University of Rochester researchers have generated light-emitting quantum dots using defects in an atomically thin semiconductor. The quantum dots initiate the production of single photons and are capable of combining quantum photonics and solid-state electronics, which is collectively called as integrated photonics.
Researchers have identified inefficient regions in perovskite materials and have shown that defects can be engineered to further improve solar devices.
Researchers at the Japanese National Institute of Materials Science, Danish Technical University, Yonsei University in Korea, University of Minnesota, Cornell, Harvard and Columbia Engineering have improved the performance of molybdenum disulfide (MoS2), a 2D material by encapsulating it in an insulating material, boron nitride (BN).
Researchers have successfully created a new three-atomic-layer-thick semiconducting material. The novel material has electronic properties better than conventional semiconductors. The material’s two nano-engineered configurations have exhibited improved light response.
The European HiPoSwitch project has developed novel nitride (GaN) transistors for high efficiency, high speed gallium nitride power switches.
An ultrathin flexible material developed by the researchers at the University of California at Berkeley behaves as a chameleon-like skin by changing colour on demand during the application of force.
AIXTRON SE, a worldwide leading provider of deposition equipment to the semiconductor industry, today announced that Taiwanese group Episil Semiconductor Wafer, Inc. has successfully put into operation an AIX G5 WW (Warm-Wall) reactor for silicon carbide (SiC) epitaxy.
Advanced Semiconductor Engineering, Inc. announced today that it has joined the Electronics Industry Citizenship Coalition (EICC), the world’s largest industry coalition committed to creating shared value for the businesses, people, and communities who collectively contribute to the manufacture of electronic devices around the world. ASE’s membership further represents the Company’s resolve to align and work with suppliers and partners that share similar values regarding sustainability.
Professor Dmitri Talapin of the University of Chicago has led a team of researchers who have developed a new method to solder semiconductors. This study, which Talapin had conducted along with his associates from UChicago, the Illinois Institute of Technology and the Argonne National Laboratory, proposes an innovative method that enables semiconductors to retain their ability to deliver good electronic performance even after being soldered.
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