STW 10 Animation Mix (Short Version)

STW-10 automated plasma system is designed for front-end semiconductor processing. It is especially well suited for activating silicon surfaces prior to hybrid wafer bonding. The STW-10 accepts FOUP’s containing 300 mm wafers, or cassettes with dies on tape frame. Maximum throughput is 60 wafers per hour.

Inside the STW-10, the Atomflo^™ plasma system generates a uniform, particle free, electrically neutral discharge that will not damage CMOS integrated circuits. The oxygen/argon plasma strips away organic contamination, while the hydrogen/argon plasma removes metal oxidation from copper, tin, and indium.

The STW-10 has all the features required in the modern semiconductor fab:

• EFEM prepared for OHT or AGV factory handling
• Cleanroom class 10 (ISO 4)
• Meets all SEMI standards
• SECS/GEM ready
• Carrier RFID or barcode recognition
• Wafer alignment and carrier mapping

Run Time: 1:20 mins

Video Credit: Surfx Techno