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Results 41 - 50 of 404 for Applications requiring higher heat resistance
  • Article - 12 Sep 2002
    A detailed look into the production of synthetic diamonds via chemical vapour deposition (CVD) is provided. The processes, growth rates and applications including cutting tools, heat spreaders,...
  • Article - 19 Oct 2001
    302HQ is a specialised wire grade finding very wide usage for manufacture of stainless steel fasteners. 3% copper in the composition reduces the cold work hardening rate compared to Grade 304.
  • Article - 13 Sep 2001
    The 316 family is a group of austenitic stainless steels with superior corrosion resistance to 304 stainless steels. They also have excellent toughness and can be used in the food, marine, chemical...
  • Article - 27 Aug 2001
    Surface treatments such as ion implantation, ion beam mixing, laser processing, PVD, CVD and laser alloying are being applied to monolithic ceramic materials to improve surface properties so that they...
  • Article - 7 Aug 2001
    Rare earth magnets produce fluxes much higher than traditional magnets of comparable size. Such magnets are based on samarium and neodymium compounds. Applications include automotive,...
  • Article - 6 Jun 2001
    Laser welding has advantages over conventional resistance welding including non-contact nature, small heat affected zone and only requires access from one side. The process is explained and how it can...
  • Article - 15 Feb 2001
    This article discusses thermoplastic composites and how they have overtaken aluminum as the production material of choice in the aviation and transportation industries.
  • Article - 6 Feb 2001
    Silicon nitride (Si3N4) comes in forms such as reaction bonded, sintered and hot pressed. Excellent thermo mechanical properties have seen this material used for engine parts, bearings, metal...
  • Article - 22 May 2024
    Join us for an exclusive interview with Dr. Weiqi Hua, Executive Vice President of Wanhua Chemical and Director of the Wanhua Chemical Research Institute. Discover how he leads innovations and shapes...
  • Article - 19 Feb 2024
    Advanced semiconductor packaging evolves with chips and 3D integration, enhancing performance and thermal management for next-gen electronics.

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