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Applications of EBSD in Analyzing Deformed High-Temperature Materials

From Dec 19 2023

Electron backscatter diffraction (EBSD) is a versatile tool for material analysis and complements other characterization techniques. This webinar highlights three case studies demonstrating its application to high-temperature materials, conducted at the Center for Electron Microscopy and Analysis (CEMAS) at The Ohio State University.

The first case explores the use of EBSD as an input for SEM-based controlled electron channeling contrast imaging (cECCI) to quantify defect structures in a creep-deformed Ni-based superalloy under specific diffraction conditions. The second case involves EBSD to select specimens for further analysis of planar defects using scanning transmission electron microscopy (STEM) with diffraction contrast imaging (DCI) and atomic-resolution energy dispersive X-ray spectroscopy (EDS). These analyses required precise FIB-prepared lamellae, aligned edge-on to the planar defects.

Lastly, EBSD is applied to study the effect of build direction on the creep resistance of additively manufactured (AM) Ti-6Al-4V. Texture and grain size evolution through dynamic recrystallization are evaluated and linked to energy dissipation characteristics observed during dynamic negative stepped (DNST) creep tests.

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